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Custom Java Card Development Capabilities
01-CHIP SELECTION
The right chip for every mission.
Three chip families covering every security grade, budget, and regulatory environment — from global fintech deployments to China sovereign projects.
NXP SEMICONDUCTORS
JCOP Series
🇳🇱 Netherlands
World’s highest-volume Java Card platform. JCOP spans from cost-optimised chips for transit and retail through to high-assurance modules for cryptocurrency hardware wallets, ePassports, and banking-grade payment cards. Full Java Card 2.2–3.0.5 compatibility guaranteed.
EAL6+
CC Certification
Payment
Crypto
eID
SIM
INFINEON TECHNOLOGIES
SECORA / SLE
🇩🇪 Germany
Engineered specifically for financial high-assurance scenarios. Native support for China national cryptographic algorithms (SM2/SM3/SM4) alongside international EMV standards — the preferred choice for banks issuing dual-standard cards and government agencies requiring sovereign encryption compliance.
Related Products：SLE78 · SECORA Pay
EAL6+
CC Certification
SM2/3/4
Bank IC
Gov eID
CHINA SOVEREIGN
Fudan · HuaDa· UniIC
🇨🇳 China
Domestically produced chips fully compliant with PBOC 3.0 and cybersecurity graded-protection requirements. Complete national cryptographic algorithm support — ideal for social security cards, provident fund cards, campus cards, and all policy-driven sovereign projects requiring supply chain sovereignty.
Related Products：FM1280 (Fudan Micro) · Huada Electronic · Unigroup Guoxin
PBOC 3.0
China Standard
Sovereign Supply
Social Security
Campus Card
02-PRODUCTION CUSTOMIZATION
Six dimensions Zero compromises.
Every production parameter is customizable — from the substrate material your card is built on, to the holographic film that protects its surface.
DIM-01
Card Substrate Material
The physical foundation of your card is chosen to match the deployment environment, durability requirements, and sustainability goals.
DIM-02
Printing Technology
From mass-production uniformity to fully variable per-card personalization — choose the printing method that matches your production scale and brand vision.
DIM-03
Interface Configuration
Define how your card communicates — contact-only for secure terminals, contactless-only for speed-critical tap scenarios, or dual-interface for universal deployment.
DIM-04
Surface Finishing
Eight premium finishing options, combinable to create a card surface that is distinctively yours — protective, functional, or purely aesthetic.
DIM-05
Quality Assurance
A two-stage inspection system that catches defects at both the visual and electrical level — every card that leaves our facility has passed both gates.
DIM-06
Packaging & Delivery
Anti-static protection for chip integrity in transit, with full white-label branding options for OEM and ODM customers who want to present the product as their own.
03-SERVICE PROCESS
From brief to batch in five steps.
A structured process that eliminates surprises and keeps your project on schedule — from first conversation to final delivery.
STEP 01
Requirements Brief
Define chip model, functional requirements, volume, and target certifications. Our engineers advise on the optimal configuration.
Day 1–2
STEP 02
Solution Design
Applet architecture, artwork design approval, surface finish selection, and interface specification locked.
Day 3–5
STEP 03
Sample Production
100pcs prototype batch produced to full specification. Physical samples shipped for your hands-on approval.
Day 7
STEP 04
Certification Testing
ISO 7816 / EMV / PBOC full certification run. Electrical performance verified against all applicable standards.
Parallel
STEP 05
Mass Production
Full volume production with dual-stage QC. Anti-static packaging and branded delivery to your door.
15 Day
04-SURFACE OPTIONS
Eight finishes Combinable.
Mix and match any combination of surface finishing options to create the exact aesthetic and functional profile your card requires.
Flat Emboss
Standard flush-printed card number, clean and modern
Raised Emboss
Traditional raised character card number printing
Magnetic Stripe
Legacy magnetic stripe for backward compatibility
Signature Panel
White signature strip on card reverse
Signature Panel
Hot-stamped metallic finish for premium branding
Signature Panel
Selective gloss enhancement on logo or elements
Holographic Film
Laser / holographic anti-counterfeit laminate layer
PSAM Encapsulation
Secure Access Module packaging format
Flat Emboss
Raised Emboss
Magnetic Stripe
Signature Panel
Signature Panel
Signature Panel
Holographic Film
PSAM Encapsulation
05-DELIVERY TIERS
Three speeds One standard.
Whether you need to move fast with a prototype or scale to mass production, the same quality standards apply at every tier.
Start your
custom project.
Tell us your requirements — chip type, volume, certifications, and timeline. Our solution team responds within one business day.
Talk to an Engineer